Improve reliability and throughput while reducing human influence.

The 4600 Bondtester is a benchtop system designed to automatically perform complex test procedures without needing operator input. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.

Applications:

Battery	Wafer Level	Micro-electronics

Paragon™ – Your automation partner

Automation assisted GUI
Build in check list & help
Multi window views
Schematic virtual images displayed

Import maps or create your own

Import wafer map file SINF / G85 / Klarf (AOI) / New Format
Wire pull and ball shear pattern displays
Colour gradients indicate different heights
Inter-die wire corrections

Remove uncertainty - camera assisted programming

Ultimate accuracy using on-board cameras
Both high resolution and field of view cameras as standard
Fiducial images for alignment

Image every failure mode – even with extreme height variations

Compound Surface Imaging (CSI) scans through a Z-stack to get every point in focus
Automatically return to the failure site to record an image
Assists with failure mode analysis
Comes as standard with every 4600 Bondtester